This role presents a unique opportunity to shape the future of AR/VR devices by enabling advanced packaging technology from concept to productization.

Job Responsibilities:
● Establish relationship with foundry, OSAT, material supplier & support package development activities for multiple research & product programs as process integration engineer
● Support TV design, process feasibility, simulation, design rule/DFM checks with emphasis on thermo-mechanical reliability with vendor
● Review & maintain all aspects of design integration (DI) before TO, sign-off & keep all DI documentation upto date
● Work with XFN teams, foundries/OSAT, substrate suppliers to understand trade-offs & keep track of technology gaps, reliability risk, yield issues & provide regular updates
● Drive DOEs for initial build and product qualification; drive triage effort with partners for any unexpected inline process, equipment & quality issues
● Coordinate FA, monitor area/customer critical charts & drive all aspects of FA & compilation of POR, TOR, FMEA & related KPIs at the vendor

Additional Required Qualifications:
Knowledge of adv. packaging manufacturing processes e.g. WLCSP, SiP, FO, PoP, TSV, 3D
● Experience with successful package product qualification with complex package design
● Understanding of device reliability and experience with physical failure analysis
● Experience with DOE, data analysis & pkg design software is a plus
● Experience with display and optic related package is a plus
● Experience with TSV process, 2.5D/3D package and Hybrid bonding is a plus
● Excellent problem solving & communication skills
● Ability to work independently and take on projects with minimum supervision

Education/Experience
● BS, MS in Materials Science, Chemical, Electrical, Mechanical Engineering or similar field
● 8+ years of experience in package development and process integration

Top 3 non-negotiable must skills:
● At least 8 years of process development or process integration in the middle or backend packaging
● Hands-on experience with Package Design, Simulation, Package Reliability, Failure Analysis
● Intermediate English Profiency - be able to interact with CWAM and global XFNs, articulate their thoughts, read and write. You will not be expected to do business presentations in English

Good to have skills:
● Pro-active, can hit the ground running
● Organized and disciplined individual - they will be managing multiple projects at one time
● Problem-solving mindset

本職缺為派遣工作，求職者個人履歷資料將作為推薦要派工作之用。

雇主依法應盡義務（含勞動基準法、性別平等工作法、全民健康保險法、勞工保險條例等）及員工依法應享權利（如勞健保、勞退、特別休假、婚假等）